AlN Filler in Thermal Interface Materials (TIMs)-Enhancing Stability and Reliability

In the field of thermal interface materials (TIM), long-term reliability is one of the core metrics for evaluating product performance, and the choice of filler directly determines the stable performance of TIM. Among these, aluminum nitride (AlN) filler has become an ideal choice for helping TIM break through reliability bottlenecks, thanks to its outstanding characteristics.

The most prominent advantage of AlN filler lies in its excellent resistance to high-temperature oxidation. During the long-term operation of electronic equipment, TIM often faces the dual challenges of thermal cycling and high-temperature environments. Ordinary fillers are prone to oxidative aging, leading to a degradation in thermal performance. In contrast, aluminum nitride can build a "protective barrier" for the TIM matrix, effectively resisting oxidation reactions under high temperatures and slowing down the material's aging process. This ensures that the TIM maintains stable thermal dissipation capability over long-term use, safeguarding the safe operation of electronic components.

Moreover, AlN filler can significantly optimize the physical properties of TIM. Its addition allows for precise adjustment of the TIM's viscosity and cohesion, fundamentally addressing the "pump-out issue" during thermal cycling. It is important to note that the pump-out effect can easily cause TIM to be squeezed out from the interface gap, leading to poor interfacial contact and a sharp decline in thermal efficiency. TIM enhanced with aluminum nitride, due to its stronger cohesion, firmly "locks" into the interface gap. Even after repeated thermal expansion and contraction, it maintains good interfacial contact, ensuring the long-term effectiveness of thermal dissipation.

About Xiamen Juci Technology Co., Ltd.

Xiamen Juci Technology Co., Ltd. is a high-tech enterprise specializing in high-performance aluminum nitride ceramic materials. We are committed to providing cutting-edge thermal management solutions for the electronics industry, with high-thermal-conductivity aluminum nitride filler powder being one of our flagship products.It is widely used in applications such as high-end chip packaging, 5G communication, new energy vehicles, and power semiconductors.